| October, 1930 |
Establishment |
|
| December, 1956 |
Foundation
Capital: JPY10 million
Involved in making decorations, rustproof plating, and industrial hard
chrome plating since first being established.
A participant in the semiconductor field since around 1959. |
| May, 1963 |
Commenced mass production of tin plating of the shells (caps) of germanium
transistors.
|
| September, 1967 |
Second factory constructed. |
 |
| September, 1968 |
Commenced mass production of partial gold and silver plating of the lead
pins of plana transistors. |
| September, 1969 |
Third factory constructed. |
| January, 1970 |
Expanded the headquarters factory. |
| September, 1971 |
Commenced mass production of the overall silver plating of lead frames. |
| January, 1976 |
Created a mass production system by self-developing a spot silver plating
machine for ICs and LSIs. |
| April, 1977 |
Created a full mass production system for hoop plating. |
| October, 1978 |
Withdrew from the industrial hard chrome plating business and shifted entirely
to the plating and processing of semiconductor parts. |
| May, 1983 |
Commenced mass production of plating the lead frames of couplers.
Increased production and created a stable supply system of silver plating
of 42 alloy. |
 |
| April, 1987 |
Moved to a new factory (Seishin factory) in the Seishin Industrial Park
because of expanding business.
Aggregated and moved the second and third factories.@@ |
February, 1994 |
Commenced mass production of stripe and overall plating of nickel-phosphorus
(Ni-P) plating. |
| January 17, 1995 |
The Hanshin-Awaji Earthquake occurred at 5:46 a.m. |
| October, 1996 |
Started manufacturing prototype palladium plating as part of lead-free
environmental conservation measures (later commenced mass production). |
| April, 1999 |
Started mass production of overall copper plating on the 42 alloy material. |
| September, 2000 |
Expanded Seishin factory. |
| April, 2002 |
Engaged in reviewing the commercialization of the gdevelopment of high-capacity
next-generation electrodes utilizing alloy plating technologyh in an industrial-government-academia
collaboration. |
| November, 2003 |
Headquarters factory and Seishin factory obtained ISO9001:2001. |
| June, 2004 |
Engaged in reviewing thin palladium plating technology. |
| June, 2004 |
gCorrespondence to lead-free electronic partsh: Successfully developed
tin plating technology that does not generate any whiskers. |
| May, 2005 |
Commenced production of thin palladium plating. |
| March, 2006 |
Certified as gExcellent Technology from Kobeh by the Kobe City Industrial
Promotion Foundation. |
 |
| May, 2006 |
Constructed a mass production facility for the overall silver plating of
LED lead frames. |
| July, 2008 |
Capital: JPY13 million |
| November, 2008 |
Headquarters factory and Seishin factory obtained ISO14001:2004.
|
